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 RT9701
100m Power Distribution Switches
General Description
The RT9701 is an integrated 100m power switch for self-powered and bus-powered Universal Series Bus (USB) applications. A built-in charge pump is used to drive the N-Channel MOSFET that is free of parasitic body diode to eliminate any reversed current flow across the switch when it is powered off. Its low quiescent current (23A) and small package (SOT-23-5) is particularly suitable in battery-powered portable equipment. Several protection functions include soft start to limit inrush current during plug-in, current limiting at 1.5A to meet USB power requirement, and thermal shutdown to protect damage under over current conditions.
Features
100m Typ. High-Side NMOSFET (SOT-23-5) Guaranteed 1.1A Continuous Current 1.5A Current Limit Small SOT-23-5 Package Minimizes Board Space Soft Start Thermal Protection Low 23A Supply Current Wide Input Voltage Range : 2.2V to 6V UL Approved - #E219878 RoHS Compliant and 100% Lead (Pb)-Free
Applications
Battery-Powered Equipment Motherboard USB Power Switch USB Device Power Switch Hot-Plug Power Supplies Battery-Charger Circuits
Ordering Information
RT9701 Package Type B : SOT-23-5 BL : SOT-23-5 (L-Type) Operating Temperature Range P : Pb Free with Commercial Standard G : Green (Halogen Free with Commercial Standard)
Pin Configurations
(TOP VIEW)
VOUT GND VIN 1 2 3 4 EN 5 VOUT VOUT GND VIN 1 2 3 4 VIN 5 VOUT
Note : RichTek Pb-free and Green products are : RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020. Suitable for use in SnPb or Pb-free soldering processes. 100% matte tin (Sn) plating.
SOT-23-5
SOT-23-5 (L-Type)
Marking Information
For marking information, contact our sales representative directly or through a RichTek distributor located in your area, otherwise visit our website for detail.
Typical Application Circuit
VIN CIN 1uF RT9701CBL VIN VOUT VIN GND VOUT VOUT * COUT 470uF
* 470uF, Low ESR Electrolytic
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RT9701
Test Circuits
VIN + RT9701CBL VIN VOUT VIN GND VOUT IOUT
+
VOUT
VIN
VIN-SW RT9701CBL VIN VOUT + VIN GND VOUT
+
VOUT
CIN 1uF
CL
RL
IL
Switch Off CIN 1uF
CL
RL
Test Circuit 1
VIN + CIN 1uF VOUT
Test Circuit 2
RT9701CB VIN VOUT EN GND VOUT
IOUT
+
CL
RL
IL
Chip Enable
Test Circuit 3 Test Circuit 2 is performed by charging an external tank of bulk capacitor to the input then applying this voltage to the input of the unit. All typical operating characteristics curves showed are referred to Test Circuit 1, unless specified to Test Circuit 2 or Test Circuit 3.
Functional Pin Description
Pin Name VIN VOUT GND EN Pin Function Power Input Voltage Output Voltage Ground Chip Enable (Active High)
Function Block Diagram
EN Bias Current Limit RS VIN (VIN)
Charge Pump
Control NMOSFET
(VOUT) VOUT
Oscillator
Thermal Detection
GND
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RT9701
Absolute Maximum Ratings
Supply Voltage --------------------------------------------------------------------------------------------------------- 7V Chip Enable ------------------------------------------------------------------------------------------------------------- -0.3V to 7V Power Dissipation, PD @ TA = 25C SOT-23-5 ---------------------------------------------------------------------------------------------------------------- 0.25W Package Thermal Resistance SOT-23-5, JA ----------------------------------------------------------------------------------------------------------- 250C /W Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260C Operating Junction Temperature Range -------------------------------------------------------------------------- -20C to 100C Storage Temperature Range ---------------------------------------------------------------------------------------- -65C to 150C VOUT ESD Level HBM (Human Body Mode) ------------------------------------------------------------------------------------------ 8kV MM (Machine Mode) -------------------------------------------------------------------------------------------------- 800V
Electrical Characteristics
(VIN = 5V, CIN = COUT = 1F, TA = 25C, unless otherwise specified)
Parameter Input Voltage Range Output NMOSFET RDS(ON) Quiescent Current Output Turn-On Rising Time Current Limit Threshold Short-circuit Fold Back Current EN Input High Threshold EN Input Low Threshold Shutdown Supply Current Output Leakage Current VIN Under Voltage Lockout VIN Under Voltage Hysteresis Thermal Limit Thermal Limit Hysteresis RT9701CB RT9701CB RT9701CB RT9701CB RT9701CBL RT9701CB
Symbol VIN RDS(ON)
Test Conditions
Min 2.2
Typ -85 87 19 23 400 1.5 1.0 --0.1 0.5 1.8 100 130 20
Max 6 100 100 40 45 -2 --0.8 1 10 -----
Units V m A s A A V V A A V mV C C
IL = 1A IL = 1A VIN = 3V VIN = 5V
-----1.1 -2.0 --
TR ILIMIT IOS
RL = 10, 90% Settling RL = 2 VOUT = 0V, measured prior to thermal shutdown
IOFF UVLO
EN = "0"
--1.3 ----
ILEAKAGE EN = "0", VOUT = 0V
TSD TSD
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RT9701
Typical Operating Characteristics
Quiescent Current vs. Temperature
40
Quiescent Current vs. Input Voltage
40
VIN = 5V
35
TA = 25C
35
Quiescent Current ( uA)
30 25 20 15 10 5 0 -40 -20 0 20 40 60 80 100 120
Quiescent Current (uA)
30 25 20 15 10 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Temperature (C)
Input Voltage (V)
On-Resistance vs. Temperature
200
100
On-Resistance vs. Input Voltage
TA = 25C
95
VIN = 5V
150
On-Resistance (m)
100
On-Resistance (m)
RT9701CBL
RT9701CB
90
RT9701CB
85
50
RT9701CBL
80
0 -40 -20 0 20 40 60 80 100 120
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Temperature () (C)
Input Voltage(V)
Current Limit vs. Temperature
2.20 2.00
1.80
Current Limit vs. Input Voltage
1.58
VIN = 5V
1.35 1.13 0.90 0.68 0.45 0.23 0.00
TA = 25C
Current Limit (A)
1.80 1.60 1.40 1.20 1.00 0.80 0.60 -40 -20 0 20 40 60 80 100 120
Current Limit (A)
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Temperature (C)
Input Voltage (V)
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RT9701
Short Circuit Current vs. Temperature
1400
1950
Short Circuit Current vs. Input Voltage
TA = 25C
1700 1450 1200 950 700 450 200
Short Circuit Current (mA)1
1200 1100 1000 900 800 700 600 500 -40 -20 0 20 40 60 80 100 120
Short Circuit Current (mA)
1300
VIN = 5V
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Temperature (C) (C)
Input Voltage (V)
EN Pin Threshold Temperature EN Threshold vs. Voltage vs.
2.4
EN EN Threshold vs. Input Voltage Pin Threshold Voltage vs. Input
2.4
VIN = 5V
TA = 25C
EN Pin Threshold Voltage (V) EN Threshold (V)
2.0 1.6
EN Pin Threshold Voltage (V) EN Threshold (V)
2.0 1.6 1.2 0.8 0.4 0.0
Rising
Rising
1.2 0.8 0.4 0.0 -40 -20 0 20 40 60 80 100 120
Falling
Falling
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Temperature (C)
*Test Circuit 3
Input Voltage (V)
*Test Circuit 3
Turn On Rising Time vs. Temperature
720
140
Turn Off Falling Time vs. Temperature
VIN = 5V
120 100 80 60 40 20 0
Turn-On Rising Time (us)
540 450 360 270 180 90 0 -40 -20 0 20 40 60 80 100 120
Turn-Off Falling Time (us)
630
VIN = 5V
RL =30 CL = 1uF Ceramic
RL = 30 CL = 1uF Ceramic
-40 -20 0 20 40 60 80 100 120
Temperature (C)
*Test Circuit 3
Temperature (C)
*Test Circuit 3
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RT9701
Shutdown Supply Current vs. Temperature
0.9
Turn-Off Leakage Current vs. Temperature
Turn-Off Leakage Current (uA) A
3.5
Shutdown Supply Current (uA)
VIN = 5V
0.8 0.6 0.5 0.3 0.2 0.0 -40 -20 0 20 40 60 80 100 120
VIN = 5V
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 120
Temperature (C)
*Test Circuit 3
Temperature (C)
*Test Circuit 3
UVLO Threshold vs. Temperature
3.50
Inrush Current Response
VIN = 5V
3.00
UVLO Threshold (V)
2.50 2.00 1.50 1.00 0.50
CL = 100uF CL = 33uF
CL = 1uF
IL = 1A/Div, RL = 1, VIN = 5V
0.00 -40 -20 0 20 40 60 80 100 120
Temperature (C)
Time (100us/Div)
Turn - On Response
Turn - Off Response
CH1
CH1
CH2
CH1: VEN: 5V/Div CH2: IOUT: 100mA/Div
CH2
CH1: VEN: 5V/Div CH2: VOUT: 1V/Div RL = 30, CL = 1uF
*Test Circuit 3
CH3: VOUT: 2V/Div
CH3
RL = 30, CL = 1uF
Time (100us/Div)
Time (50us/Div)
*Test Circuit 3
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RT9701
UVLO at Rising
CH1 CH2
UVLO at Falling
CH1
CH1: VIN: 1V/Div CH2: VOUT: 1V/Div RL = 30, CL = 1uF CH1: VIN: 1V/Div CH2: VOUT: 1V/ Div RL = 30, CL = 1uF
CH2
Time (500us/Div)
Time (100ms/Div)
*Test Circuit 2
Inrush Short Circuit Response
CH1: VIN: 2V/Div
Soft - start Short Circuit Response
CH1: VIN: 2V/Div
VDROP=1.2V, depend on CIN ESR IPEAK : depend on ESR & ESL
CH1
CH1
CH2: IOUT: 1A/Div
CH2
CH2: IL: 10A/Div
CIN = 1uF, CL = 1000uF
CH2
CIN = 1uF
Time (25us/Div)
Time (5us/Div)
Ramped Load Response
CH1
VOUT = 4.6V VOUT= 5V 4.9V
Current Limit Response
CH1
Loading trigger
Current Limit Threshold
1.1V
CH2 CH2
CH2: IOUT: 500mA/Div VIN = 5V, CL = 1uF CH2: IOUT: 1A/Div VIN = 5V, CL = 0.1uF RL = 1
Time (1ms/Div)
Time (5us/Div)
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RT9701
Thermal Shut Response
CH1
Dowm
Current Limiting and Short Protection The current limit circuit is designed to protect the system supply, the MOSFET switch and the load from damage caused by excessive currents. The current limit threshold is set internally to allow a minimum of 1.1A through the MOSFET but limits the output current to approximately 1.5A typical. When the output is short to ground, it will limit to a constant current 1A until thermal shutdown or short condition removed.
VIN CIN 1uF RT9701CBL VIN VOUT VIN GND COUT VOUT VOUT1 VOUT2 COUT
CH3
Thermal Shut Down
CH2
CH1: VEN = 5V/Div, CH3: IOUT@RL1: 1A/Div CH2: IOUT@short: 1A/DiV, VIN = 5V
Time (50ms/Div)
Application Information
The RT9701 is a high-side single N-Channel MOSFET switch with active-high enable input. Input and Output VIN (input) is the power supply connection to the circuitry and the drain of the output MOSFET. VOUT (output) is the source of the output MOSFET. In a typical circuit, current flows through the switch from VIN to VOUT toward the load. Both VOUT pins must be short on the board and connected to the load and so do both VIN pins but connected to the power source. Thermal Shutdown Thermal shutdown shuts off the output MOSFET if the die temperature exceeds 130C and 20C of hysteresis forces the switch turning off until the die temperature drops to 110C. Soft Start In order to eliminate the upstream voltage droop caused by the large inrush current during hot-plug events, the "soft-start" feature effectively isolates power supplies from such highly capacitive loads. Under-voltage Lockout UVLO prevents the MOSFET switch from turning on until input voltage exceeds 1.8V (typical). If input voltage drops below 1.8V (typical), UVLO shuts off the MOSFET switch.
CIN = 1uF, COUT = 470uF (Low ESR) on M/B CIN = 1uF, COUT = 330uF (Low ESR) on Notebook CIN = 10uF, COUT = 1uF on USB device
Figure 1. High Side Power Switch
VIN
CIN
VIN EN
RT9701CB VOUT VOUT GND VOUT1 COUT
VOUT2 COUT
Chip Enable
Figure 2. High Side Power Switch with Chip Enable Control Filtering To limit the input voltage drop during hot-plug events, connect a 1F ceramic capacitor from VIN to GND. However, higher capacitor values will further reduce the voltage drop at the input. Connect a sufficient capacitor from VOUT to GND. This capacitor helps to prevent inductive parasitics from pulling VOUT negative during turn-off or EMI damage to other components during the hot-detachment. It is also necessary for meeting the USB specification during hot plug-in operation. If RT9701 is implanted in device end application, minimum 1F capacitor from VOUT to GND is recommended and higher capacitor values are also preferred.
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RT9701
In choosing these capacitors, special attention must be paid to the Effective Series Resistance, ESR, of the capacitors to minimize the IR drop across the capacitor ESR. A lower ESR on this capacitor can get a lower IR drop during the operation. Ferrite beads in series with all power and ground lines are recommended to eliminate or significantly reduce EMI. In selecting a ferrite bead, the DC resistance of the wire used must be kept to a minimum to reduce the voltage drop. Reverse current preventing The output MOSFET and driver circuitry are also designed to allow the MOSFET source to be externally forced to a higher voltage than the drain (VOUT > VIN 0). To prevent reverse current from such condition, disable the switch (RT9701CB) or connect VIN to a fixed voltage under 1.3V.
Layout and Thermal Dissipation Place the switch as close to the USB connector as possible. Keep all traces as short as possible to reduce the effect of undesirable parasitic inductance. Place the ot capacitor and ferrite beads asclose to the USB connector as possible. If ferrite beads are used, use wires with minimum resistance and large solder pads to minimize connection resistance. If the package is with dual VOUT or VIN pins, short both the same function pins as Figure 1 or Figure 2 to reduce the internal turn-on resistance. If the output power will be delivered to two individual ports, it is specially necessary to short both VOUT pin at the switch output side in order to protect the switch when each port are plug-in separately. Under normal operating conditions, the package can dissipate the channel heat away. Wide power-bus planes connected to VIN and VOUT and a ground plane in contact with the device will help dissipate additional heat.
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RT9701
Outline Dimension
H D L C B
b A A1 e
Symbol A A1 B b C D e H L
Dimensions In Millimeters Min 0.889 0.000 1.397 0.356 2.591 2.692 0.838 0.080 0.300 Max 1.295 0.152 1.803 0.559 2.997 3.099 1.041 0.254 0.610
Dimensions In Inches Min 0.035 0.000 0.055 0.014 0.102 0.106 0.033 0.003 0.012 Max 0.051 0.006 0.071 0.022 0.118 0.122 0.041 0.010 0.024
SOT-23-5 Surface Mount Package
Richtek Technology Corporation
Headquarter 5F, No. 20, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789 Fax: (8863)5526611
Richtek Technology Corporation
Taipei Office (Marketing) 8F, No. 137, Lane 235, Paochiao Road, Hsintien City Taipei County, Taiwan, R.O.C. Tel: (8862)89191466 Fax: (8862)89191465 Email: marketing@richtek.com
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DS9701-13 March 2007


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